Volume pricing available · Sourcing records available on request
Responds within 24 hours
PARAMETER
VALUE
Manufacturer
Molex
Series
87746
Package
Tray
Connector Style
DIMM
Number of Positions
240
Memory Type
DDR2 SDRAM
Standards
MO-237
Mounting Type
Through Hole
Features
Board Guide, Latches
Mounting Feature
Normal, Standard - Top
Card Thickness
0.050" (1.27mm)
Height
0.570" (14.50mm)
Color
Black
Contact Finish
Gold
Contact Finish Thickness
15.0µin (0.38µm)
FAQs
Can you guarantee authenticity for obsolete parts?
In the obsolete market, absolute guarantees are not realistic due to fragmented supply chains. Instead, we control risk through supplier selection, inspection, and risk-based testing aligned with industry standards.
What if parts fail after delivery?
All parts are covered by a 45-day functional warranty from the date of receipt. Claims must be supported by an accredited third-party test report.
Can I request specific tests before shipment?
Yes. You can request tests such as X-ray, decapsulation, electrical testing, or others based on your requirements. These are arranged through certified labs at additional cost.
Do you provide inspection or test reports?
Yes. Inspection images and test reports (if testing is conducted) can be shared prior to shipment upon request.
What happens if I reject it after inspection?
If rejection is based on valid findings from an agreed inspection or test, we will review and support resolution. Orders are otherwise non-cancellable once procurement is completed.
Do you require advance payment?
Yes. Orders are processed on advance payment due to the nature of sourcing obsolete components.
Who handles shipping and logistics?
Shipping is typically done on the customer’s DHL, FedEx, or UPS account. If needed, we can arrange shipment on your behalf.
Is escrow or milestone-based payment available?
Yes. Orders are executed through an escrow-based structure. Funds are released to the supplier only after delivery and buyer approval, ensuring control over both quality and transaction risk.
