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HEATSINK CPU 28MM SQ BLK W/TAPE

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| PARAMETER | VALUE |
|---|---|
| Manufacturer | Wakefield Thermal Solutions |
| Series | 658 |
| Type | Top Mount |
| Package Cooled | BGA |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Shape | Square, Pin Fins |
| Length | 1.100" (27.94mm) |
| Width | 1.100" (27.94mm) |
| Fin Height | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise | 3.0W @ 50°C |
| Thermal Resistance @ Forced Air Flow | 6.00°C/W @ 200 LFM |
| Material | Aluminum |
| Material Finish | Black Anodized |
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