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HEATSINK STAMP 22.9X8X10.2MM
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| PARAMETER | VALUE |
|---|---|
| Manufacturer | Comair Rotron |
| Package | Bulk |
| Type | Top Mount |
| Package Cooled | TO-252 (DPak) |
| Attachment Method | SMD Pad |
| Shape | Rectangular, Fins |
| Length | 0.315" (8.00mm) |
| Width | 0.900" (22.86mm) |
| Fin Height | 0.400" (10.16mm) |
| Power Dissipation @ Temperature Rise | 2.5W @ 35°C |
| Thermal Resistance @ Forced Air Flow | 17.50°C/W @ 300 LFM |
| Material | Copper |
| Material Finish | Tin |
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